| 摘要 |
PROBLEM TO BE SOLVED: To provide a side wall removing solution which is capable of removing a side wall at a low temperature in a short time without corroding a wiring material, by a method wherein the removing solution contains amino alcohol, tetraalkylammonium hydroxide, water, organic solvent, and anticorrosives as integral components. SOLUTION: An exposed metal layer 3 is subjected to a dry etching treatment. At this point, a part, of the metal layer 3 where resist is removed is etched, and a side wall 6 is formed at the same time. In succession, a resist pattern 4 is removed by ashing, and a metal wiring pattern 3 is formed. The side wall 6 is removed by the use of a side wall removing solution. At this point, the side wall removing solution is composed of amino alcohol such as N-methyl monoethanolamine or the like, tetraalkylammonium hydroxide, water, organic solvent such as ethylene glycol or the like, and corrosives such as glucose or the like. By this setup, the side wall 6 'can be removed by the removing solution at a low temperature in a short time without corroding a wiring material.
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