| 摘要 |
PROBLEM TO BE SOLVED: To obtain a substrate processing device, which can eliminate a use amount of a processing solution and can contain a specified chemical solution component of a sufficient amount in the processing solution at the time when a substrate is processed, when the substrate is impregnated in the processing solution having the chemical solution component incidental to a natural deterioration to process it. SOLUTION: At specified time tA1 prior to the processing start of a cleaning process C1, a sulfuric acid concentration adjustment operation A1 is conducted, and sulfuric concentration (shown by a line DL) is held at a constant value. Thereafter, a supplement operation B1 of a hydrogen peroxide solution is rendered at a time tB1, a substrate is led into a processing solution within a processing bath to conduct the cleaning process C1 at time tC1. As a supplement operation B1 of the hydrogen peroxide solution is conducted immediately before the cleaning process C1 of the substrate, it is possible to restrict influences due to a natural deterioration of the hydrogen peroxide solution to be minimum. Furthermore, since the sulfuric acid concentration is held constant, the number of times of use of the same processing solution can be increased until the entire amount is replaced, a consumption amount of the processing solution can be decreased. Incidentally, the supplement operation of the hydrogen peroxide solution has only to be rendered at a period of time from immediately prior to the substrate is led into the processing solution until immediately after it.
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