发明名称 ELECTRON BEAM DRAWING DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electron beam drawing device for drastically reducing the setting error of the amount of dosage of electron beams and for improving the setting accuracy of electron beams, and a method for manufacturing a semiconductor device. SOLUTION: In an electron beam-drawing device, a first forming aperture AP1 where an electron beam 2 emitted from an electron beam source 1 is applied is installed at the lower portion of the electron beam source 1, a forming polarizer 3 is installed at the lower portion of the first forming aperture AP1, and a second forming aperture AP2 is installed at the lower portion of the forming polarizer 3. In the electron beam drawing device, a plurality of cell patterns are formed at the second forming aperture AP2, one side of the cell patterns is smaller than one side of cell pattern of the first forming aperture AP1, and the opening of the cell pattern of the second forming aperture AP2 cannot be changed by the first forming aperture AP1 and the forming polarizer 3.
申请公布号 JP2000164490(A) 申请公布日期 2000.06.16
申请号 JP19980335188 申请日期 1998.11.26
申请人 HITACHI LTD 发明人 IWASAKI TERUO;HAYAKAWA HAJIME
分类号 H01L21/027;G03F7/20;(IPC1-7):H01L21/027 主分类号 H01L21/027
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