| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is enhanced in reflow resistance, thermal cycle resistance, and moisture resistance by a method wherein a semiconductor device adhesive sheet provided with an adhesive layer is used, where the adhesive layer is subjected to an extraction treatment under a certain condition for a prescribed time using pure water as extractant certain times as heavy as the adhesive layer, and the extracted water is prescribed in pH. SOLUTION: An adhesive agent layer 6 is interposed between a flexible insulating film 3 formed on each side of a semiconductor integrated circuit 1 and a layer 7 where no conductor pattern is formed. The adhesive layer 6 contains thermoplastic resin such as phenolic novolak epoxy resin and acrylonitrile-butadiene copolymer and hydrotalcite compound, and when the adhesive layer 6 and pure water 10 times as much in weight as the adhesive layer 6 are subjected to an extraction treatment that is carried out at a temperature of 121 deg.C and an RH(relative humidity) of 100% for 20 hours, the extracted water is set within a pH range of 4 to 9, and an adhesive sheet 24 provided with the above adhesive layer 6 is used. By this setup, an adhesive sheet can be improved in reflow resistance, thermal cycle properties, and moisture resistance. |
