| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric conversion module, which can prevent peeling-off between substrates and electrodes and between the electrodes and thermoelectric elements caused by a thermal stress and can prevent deterioration of a durability of an O-ring provided on the substrate. SOLUTION: In the thermoelectric conversion module, having a plurality of thermoelectric elements which have a Peltier effect, and a heat-radiating substrate 1 and heat-absorbing substrate located on heat-radiating and heat- absorbing sides of the elements respectively, the heat-radiating substrate 1 has a linear thermal expansion coefficient of 6×10-6/ deg.C or less and preferably 2×10-6/ deg.C or less. The substrate 1 is made of an alloy, containing Ni, Fe and Co, an alloy containing Fe and Pd, an alloy containing Fe and Pt, or an alloy containing Fe and Pt. More specifically, the substrate 1 is made of an Ni-Fe alloy (30-45 weight % of Ni), an Ni-Fe-Co alloy (28-40 weight % of Ni and 1-8 weight % of Fe), and Fe-Pd alloy (62-75 weight % of Fe) or an Fe-Pt alloy (60-80 weight % of Fe).
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