| 摘要 |
PROBLEM TO BE SOLVED: To reduce damages to a semiconductor chip caused by the application of stresses to the chip from a silica filler at plastic molding by making the molding material of resin material, chief component of which is a silica filler, whose grain is spheroidal with the grain diameter within a specified range. SOLUTION: In a process of manufacturing a plastic molded semiconductor device, the semiconductor resin-molding material used in a resin molding process includes as a main ingredient, a silica filler whose grains are small and spheroidal with a grain diameter of at least 5μm and at most 24μm. The silica filler is added with a stress-reducing agent. By using such material, stress applied to a semiconductor chip from the silica filler can be reduced at plastic molding or when a user uses a semiconductor device as a resin molded finished product. Moreover, even if the semiconductor chip is applied with stress by the silica filler, the damages to the semiconductor chip can be drastically reduced, and thereby the quality of a semiconductor device as a finished product can be increased.
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