| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device equipped with an electronic component lead frame which is free from lead that is an environment contaminating substance, satisfactory in solder wettability and bonding strength, and a manufacturing method thereof. SOLUTION: A lead frame is formed of nickel, nickel alloy, copper, copper alloy, iron, or iron alloy and is equipped with inner leads 2 coated with a surface treatment layer of silver or alloy which contains silver and outer leads 1 coated with an alloy surface treatment layer which contains silver and tin that is of body-centered tetragonal structure and preferentially oriented to a (101) plane and/or a (211) plane.
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