| 摘要 |
PROBLEM TO BE SOLVED: To display an excellent communication capability even through integrating a coil with a chip. SOLUTION: In a semiconductor device provided with a coil 33, a processing circuit 22 which performs communication through the coil 22, and a chip 31 whose principal surface is equipped with the processing circuit 22. The processing circuit 22 is formed on the front side of the chop 31, and the coil 33 having a magnetic layer 33d is formed on the rear side. Thus, not only crosstalk is prevented but also the coupling and tuning capabilities of the coil are improved. |
