| 摘要 |
PROBLEM TO BE SOLVED: To automate inspection by recording an image of a region containing a border between adjacent fields, determining a singular figure among figures which matches a pattern image through pattern matching, and quantifying a shift from a plot position based on a differential vector between a measurement value and a set value, which exist in one and other field regions. SOLUTION: A semiconductor substrate 3 is held on a two-dimensional moving means 2 with a plot facing up in a body 11 of an inspection apparatus 1, and a SEM4 is placed facing oppositely the upper face of the substrate 3. Secondary electrons emitted from the SEM4 are stored in an image storing means 5 as images. The image storage means 5 extracts a figure which matches with a pattern image through pattern matching with comparison standards to determine singular figures. An image processing means 7 calculates a actual measured value of a figure coordinate vector, while a control arithmetic calculator 8 quantifies stitching, based on a differential vector between the actual measured value and a set value, which exist in one and other field regions where the singular figures exist. |
