| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a method for forming a coating with low dielectric constant. SOLUTION: A solution containing at least two resins containing an Si-H group and a solvent is deposited on a substrate, so that at least 5 vol.% solvent remains in coating after being deposited on the substrate, a coating that is obtained after that is exposed to an environment containing a base catalyst with sufficient concentration for condensing the Si-H group and water, and the coating is formed on the substrate which contains formation on the coating and has a porous net-shaped structure by depositing the solvent from the coating. This method is especially useful for executing coating a low dielectric constant to an electronic device.</p> |
