| 摘要 |
PROBLEM TO BE SOLVED: To enable a misalignment of a die to be more accurately recognized by a method wherein a die reverse rotation device is provided to an optical recognition device so as to enable a suction nozzle to be rotated at an outside part corresponding to an opening window in the directions of a die pickup position and a die delivery position. SOLUTION: A shaft is fixed on the sides of an opening window 21a of the main body 21 of an optical recognition device 20, and the toothed wheel 32 of a die reverse rotation device 30 is releasably supported on the shaft. A drive source 33 as a motor or the like is fixed on the underside of the main body 21, a toothed wheel 34 engaged with the toothed wheel 32 is fixed to the output shaft of the drive source 33, a chuck nozzle 35 is fixed to the toothed wheel 32, and a chuck hole 35a is provided in the chuck nozzle 35. The one end of a tube 36 is connected to the chuck hole 35a, and the other end of the tube 36 is connected to a vacuum source through the intermediary of a chuck nozzle solenoid valve. By this setup, a flip chip bonding device can be lessened in size, and the fact that a die 3 gets out of position can be more accurately recognized. |
