| 摘要 |
PROBLEM TO BE SOLVED: To uniformly supply temperature applying fluids to a plurality of respective electronic components, to prevent a deviated temperature and to shorten temperature raising and lowering times, by supplying in parallel the fluids to the components from supply ports of the fluids. SOLUTION: When a temperature is applied, warm air or cold air is supplied from a temperature applying unit 13. When the warm or cold air is fed along a ceiling surface of a test chamber 102, its part is blown directly to an IC to be tested through a first vent hole 112 formed at a Z-axis driver 110 and a second vent hole 122 formed at a matching plate 120. The other warm or cold air is detoured along a right sidewall to the chamber 102 and is returned to a suction port 135 of a temperature applying] unit 103 through a gap between the plate 102 and a test tray TST. That is, a handler can blow cold air blown out from a supply port 134 of the unit 130 perpendicularly as well as parallel to a plurality of ICs to be tested mounted in a planner state.
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