| 摘要 |
PROBLEM TO BE SOLVED: To obtain a vertical probe card with which various electrical characteristics of more semiconductor integrated circuits can be measured simul taneously by a method, wherein the edge part of an opening part which is formed in a substrate, is formed so as to be in a nearly tiered-stand shape which becomes lower the closer it is brought to the inside and signal wires are exposed in respective layers. SOLUTION: The edge part of an opening 301 in a substrate is formed in a tiered-stand shape, which becomes lower as it is brought close to the inside. Signal wires 312, 322, 323 are exposed in respective layers 310 to 330. Consequently, in the assembling process of this vertical probe card, parts having the same name are connected by conductors 400. In an assembling operation, a probe 100 on the outermost side is connected to the area of the first layer 310 on the innermost side, a probe 100 which is second from the outer side is connected to the area of the second layer 320, and a probe 100 on the innermost side is connected to the area of the third layer 330 on the outermost side. In this manner, after the conductor 400 is overlapped on the upper side of the conductor 400 which is connected first, and the possibility that the conductors 400 becoming entangled in the assembling operation is reduced to a minimum.
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