| 摘要 |
PROBLEM TO BE SOLVED: To prevent a continuity failure from occurring in a film carrier tape by a method wherein a part of a solder resist layer near a flexure slit is formed thicker than the other part of the solder resist layer. SOLUTION: An electronic part mounting film carrier tap (TAB) is composed of an insulating film 10 and a wiring pattern 30 formed of an electrolytic copper foil pasted on the film 10 with an adhesive agent layer 12. A solder resist 20 is applied on the wiring pattern 30 to protect its surface. At this point, a part of the solder resist 20 adjacent to a flexure slit 45 is formed thicker than the other part of the resist 20. By this setup, a continuity failure can be restrained from occurring in a TAB tape, and a device can be surely mounted.
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