| 摘要 |
PROBLEM TO BE SOLVED: To obtain a wet-etching device for an edge of a semiconductor disc, capable of removing burrs from a wafer edge by a prescribed method without the possibility of wafer contamination. SOLUTION: A wet-etching device of an edge of a semiconductor disc is provided with a support part 12, having a support surface 12f rotatably supporting a semiconductor disc 10, and a nozzle 18 disposed on the semiconductor disc 10, and an exist part 20 is designed to match its direction so that an etching liquid jet 22 to be released from the exit part 20 of the nozzle is hit on a prescribed surface apt of an edge 10k of the semiconductor disc 10 at angle in the range of 0 deg. to 90 deg., with respect to a face E of the semiconductor disc 10 to be treated.
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