| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of delamination of ends of a wiring conductor layer caused by the difference in thermal expansion between the wiring conductor layer to which high current is applied and a ceramic insulating board, and maintain favorable bonding between the conductor layer and the insulating substrate in any environment. SOLUTION: On the surface of a ceramic insulating substrate 2 such as alumina, aluminium nitride, silicon nitride or the like of this ceramic wiring board 1, there is formed a wiring conductor layer 3 wherein a conductor containing as the main ingredient at least one selected from the group consisting of Cu, Ag, Au, Al, Sn and Pb and allowing current of 1 A or higher to flow is embedded in a convex part 4 with a depth t of 100μm or deeper. The width (x) of the aperture on the substrate surface side of the concave part 4 is set to be smaller than the maximum width (y) in the concave part 4 and, particularly, so that the value represented by (y-x)/(2t) is 1 or larger.
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