发明名称 ELECTRONIC COMPONENT CASE
摘要 PROBLEM TO BE SOLVED: To suppress harmonic noise or electromagnetic noise from an electronic component in a case to the outside or from the outside to the electronic component by forming a conductive film at least partially on the bottom face of the case and bringing the conductive film to the ground potential along with a circuit board. SOLUTION: An electronic component made of piezoelectric material (e.g. a quartz oscillator) is contained in a case 3 made of ceramic material or resin material. A conductive film 1 of same material as a terminal part (subjected to metallization or metal stiffening) is formed at least partially on the bottom face of the case 3 and connected with the ground potential of a mounting a circuit board 2. Consequently, the case 3 is shielded entirely. Since shield effect of the bottom face of the case 3 is enhanced, harmonic noise or electromagnetic noise from the direction of the circuit board 2 mounting the case 3 is suppressed efficiently. Furthermore, the effect of noise from the case onto the outer circumference is also suppressed.
申请公布号 JP2000165086(A) 申请公布日期 2000.06.16
申请号 JP19980355433 申请日期 1998.11.30
申请人 KINSEKI LTD 发明人 AKAGAWA HIROAKI
分类号 H05K9/00;H01L23/00;H03H9/02;(IPC1-7):H05K9/00 主分类号 H05K9/00
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