| 摘要 |
PROBLEM TO BE SOLVED: To prevent large warpage of a ceramic substrate from occurring when a metal circuit board is attached onto the ceramic substrate. SOLUTION: A metal layer 2 is coated on the surface of a ceramic substrate 1 and a metal circuit board 3 is attached onto the metal layer 2 via solder material 4 in this ceramic circuit board. A protrusion member 1a in a frame shape is attached in the periphery of the surface of the ceramic substrate 1 via bonding material 5. If the difference between the thermal expansion coefficient of the protrusion member 1a and that of the ceramic substrate 1 exceeds 5 ppm/ deg.C, the Vickers hardness of the bonding material 5 is made 50 Hv or less.
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