| 摘要 |
PROBLEM TO BE SOLVED: To prevent unnecessary ink from getting on electronic circuit dies by a method wherein a plurality of the electronic circuit dies are provided on a semiconductor wafer and marking parts with the four sides encircled with step parts are respectively provided on the surfaces of those dies. SOLUTION: Marking parts 5 with the four sides encircled with step parts are respectively provided on the surfaces of a plurality of electronic circuit dies on a semiconductors wafer 1 and the step parts 4 are formed of an aluminum Al pattern. Ink for a defective mark 3 is prevented from flowing in the dies adjacent to the mark 3 by the step parts 4 around the marking parts 5. Accordingly, as the aluminum step parts 4 are previouly formed on the surfaces of the electronic circuit dies and the marking parts 5 are formed within the parts 4, the ink is stopped by the parts 4 when a defective marking is put and it is eliminated that the ink gets on the dies around the defective marking. As the result, it can be prevented that the dies adhered with the ink are identified as defective dies 2c by the adhesion of unnecessary ink and are completely eliminated.
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