| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with a slide calipers pattern for forming the durable slide calipers pattern quickly and for forming the durable slide calipers pattern at an arbitrary layer even in the case of multilayer structure, and its manufacturing method. SOLUTION: An interlayer film 2 made of an insulation member that is formed directly or through another lamination member on a substrate, a slide calipers pattern 3A that is applied to the interlayer film 2, a predetermined semiconductor element (internal circuit part) 1a, and its wiring layer 3B are provided. Then, an interlayer film fixing layer 3C made of a given metal member is provided between the end face part of the interlayer film 2 and the substrate 1, thus integrating the interlayer film fixing layer 3C into the substrate 1 and hence preventing the interlayer film from being delaminated out of an end part. |
