| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for taking out a semiconductor chip with which the semiconductor chip can be taken out without damaging the circuit surface of the semiconductor chip, while removing a protective film efficiently. SOLUTION: A wafer 1, in which a protective film 2 is formed entirely on one side thereof, is cut from the opposite side to the protective film formation surface so that the protective film 2 is left as it is, and individual semiconductor chips 5 connecting with the protective film 2 are formed. The semiconductor chips 5 are peeled off separately from the protective film 2. Thus, the semiconductor chip can be taken out without coming in contact with the circuit surface 6 of the semiconductor chip 5, and further the circuit surface 6 thereof is hardly damaged. Since the semiconductor chip 5 is peeled off one by one from the protective film 2 in a state such that it is connected with the film 2, the chip 5 can be obtained efficiently by only peeling off it from the film 2.</p> |
