发明名称 NONCONTACT TYPE PLATE THICKNESS MEASURING INSTRUMENT
摘要 PROBLEM TO BE SOLVED: To provide a noncontact type plate thickness measuring instrument which is easily installed, will not malfunction, and can accurately measure the thickness of a plate material. SOLUTION: This noncontact type plate thickness measuring instrument is equipped with a laser light source 5, a photodetection part 6, a sensitivity adjustment part 7, a sensitivity detection part 8, a detection control part 9, and a data processing part 10. The laser light source 5 emits laser light, while scanning an end surface of a plate material 3 along the thickness. The photodetection part 6 photodetects and converts light reflected by the end surface into an electric signal. The sensitivity adjustment part 7 amplifies the electrical signal. The sensitivity detection part 8 optimizes the sensitivity of the sensitivity adjusting part 7. The detection control part 9 binarizes the signal obtained by the sensitivity adjustment part 7, on the basis of a threshold and generates a pulse waveform. The data processing part 10 calculates the thickness of the plate material 3 according to the scanning time of the pulse waveform, wherein data larger than the threshold can be obtained. Furthermore, thickness is displayed at a display part 14.
申请公布号 JP2000161924(A) 申请公布日期 2000.06.16
申请号 JP19980349340 申请日期 1998.11.25
申请人 USC CORP 发明人 SAKAI YASUHIRO;KANEDA FUMIO
分类号 G01B11/06;(IPC1-7):G01B11/06 主分类号 G01B11/06
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