| 摘要 |
PROBLEM TO BE SOLVED: To provide a pin which is uniformly high in solder wettability, a manufacturing method thereof, and a wiring board provided with pins which are uniformly wetted with solder and soldered positively. SOLUTION: A pin 10A fixed to a wiring board main body by soldering is equipped with a pin main body 1, an electroless Ni-P plating layer deposited on the surface of the pin main body 1, and an electroless flash Au plating layer deposited on the electroless Ni-P plating layer. These plated layers are treated thermally at a temperature of 460 deg.C in a heating oven at OV in a non- oxidizing atmosphere of 75% H2-25% N2. With this thermal treatment, moisture attached in a plating process can be removed, and since a diffused layer of nickel and gold is formed on the pin 10A to improve the pin 10A in solder wettability, the pin 10A is wetted uniformly with solder when it is soldered. Therefore, when the pin 10A subjected to thermal treatment is soldered to the pad of a wiring board main body, solder spreads nearly like a conical fillet, so that pin 10A can be surely soldered. |
