MANUFACTURE OF CHIP INDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method by which a chip inductor can be mass-produced. SOLUTION: A large-sized ceramic insulating substrate 15 of multiple allocation which becomes a plurality of insulating substrates 1 when the substrate 15 is cut is prepared. A conductive thin film 7 is formed on the whole external surface of the substrate 15. Then partial grooves 9A,... for constituting surface- side spiral grooves are formed by irradiating the thin film 7 formed on inductor forming sections 5,... with laser light from the front surface 15a side of the substrate 15. In addition, spiral grooves are formed by forming partial grooves for constituting back side spiral grooves by irradiating the thin film 7 formed on the inductor forming sections 5,... of insulating substrate constituting sections with laser light from the back side of the substrate 15. Moreover, insulating coating layers are formed by coating the inductor forming sections 5,... with an insulating material, and a plated-solder layer is formed by plating the external surface of the substrate 15 with solder. Finally, the insulating substrate constituting sections 2 are separated from the substrate 15.