| 摘要 |
PROBLEM TO BE SOLVED: To prevent a wafer from being directly or indirectly damaged or cracked by a method wherein adjacent wafers are restrained from coming into contact with each other due to the deformation of a wafer carrier caused by a centrifugal force induced in rotation. SOLUTION: Adjacent wafers are restrained from coming into contact with each other due to the deformation of a wafer carrier caused by a centrifugal force induced in rotation. The wafer carrier holds the periphery of the wafer by a groove, the groove is restrained from applying stress on the periphery of the wafer due to the deformation of the wafer carrier caused by a centrifugal force induced by the rotation of the wafer carrier. The wafer carrier is formed of plastic material and holds the wafer by the periphery with its groove. When the wafer carrier is rotated to dry out a wafer taking advantage of a centrifugal force, the wafer carrier is enhanced in rigidity by an adapter so as to be less deformed by a centrifugal force.
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