| 摘要 |
PROBLEM TO BE SOLVED: To realize an appearance inspecting device for detecting the defect of the pattern of a semiconductor wafer, having units mutually connected by an optical fiber cable. SOLUTION: This appearance inspecting device for inspecting the defect of the pattern of a semiconductor wafer 13 is provided with an image gaining means 21 for successively gaining the image of each die of the semiconductor wafer 13 having a plurality of dies; an image processing means 22 for performing a defect detecting processing to the image; and an xy-stage control means 23 for controlling an xy-stage 11 having a sample stage 12 for placing the semiconductor wafer 13. The image gaining means 21 is connected to the image processing means 22 through an optical fiber cable 41.
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