| 摘要 |
PROBLEM TO BE SOLVED: To prevent cracks of semiconductor wafers by excluding the influences of bumps, without reducing quality of a pellet and contaminating natural environment in grinding rear faces of semiconductor wafers, in particular semiconductor wafers formed with the bump on the surface. SOLUTION: An elastic pad 13 is formed with numberless pores on at least the surface, and has a suction force caused by a means, in which when it is pressed with a restoring force and the close adhesion due to elasticity, the pores are crushed to cause a negative pressure and has a specified thickness. The elastic pad 13 is mounted on a surface 12 of a semiconductor wafer 10, so that a bump is embedded in the elastic pad 13, and the semiconductor wafer 10 is mounted on a chuck table of a grinding attachment with the elastic pad 13 set below, and a pressing force due to a rotating grinding wheel is added to grind a rear face of the semiconductor wafer 10.
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