发明名称 RF CIRCUIT MODULE
摘要 <p>An RF circuit module comprises a first RF semiconductor device (19) placed in a cavity (4) enclosed by a wall (3) of a first dielectric circuit board (1) and a second RF semiconductor device (29) mounted on a second dielectric circuit board (2) placed on the wall (3). The first dielectric circuit board (1) is provided with a metal base (11). A lot of buried conductors (13), such as via holes, are provided in the wall (3) around the cavity, and each of the buried conductors (13) has one end connected electrically with the metallic base and the other end exposed. A metal cover (12) connected electrically with the buried conductors (13) is provided on the wall (3).</p>
申请公布号 WO2000035015(P1) 申请公布日期 2000.06.15
申请号 JP1999003236 申请日期 1999.06.17
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