发明名称 POSITIVELY PHOTOSENSITIVE RESIN COMPOSITION
摘要 A positively photosensitive resin composition which exhibits high sensitivity and a high resolving power, can form good patterns and attain a high aspect ratio and an excellent throughput in the production, and is reduced in the process dependence of dimensional accuracy. This composition comprises (i) a photosensitive novolak resin prepared either by reacting an alkali-soluble novolak resin freed from low-molecular-weight components by fractionation with an o-naphthoquinonediazide compound or by subjecting a reaction product of an alkali-soluble novolak resin with an o-naphthoquinonediazide compound to fractionation to thereby free the reaction product from low-molecular-weight components and (ii) a low-molecular compound having a phenolic hydroxyl group.
申请公布号 WO0034829(A1) 申请公布日期 2000.06.15
申请号 WO1999JP06729 申请日期 1999.12.01
申请人 CLARIANT INTERNATIONAL LTD.;CLARIANT(JAPAN) K.K.;SUSUKIDA, KENJI;ARANO, AKIO;NISHIKAWA, MASATO 发明人 SUSUKIDA, KENJI;ARANO, AKIO;NISHIKAWA, MASATO
分类号 G03F7/022;G03F7/023;(IPC1-7):G03F7/023;G03F7/004;H01L21/027 主分类号 G03F7/022
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