| 摘要 |
PURPOSE: A circuit board structure for semiconductor package and a method for manufacturing the circuit board structure is provided to improve the circuit by way of implemented a ground ring around a cavity. CONSTITUTION: A circuit board structure for semiconductor package and a method for manufacturing the circuit board structure includes circuit patterns(2,3), radiating plate(4), a BT resin(1), ground ring(6), a cavity(20), and a plurality of slot holes(10). The circuit patterns(2,3) are formed on and under the BT resin(1). The radiating plate(4) is glued under the BT resin(1). The ground ring(6) is rectangular and implemented in the center of the BT resin(1). The cavity(20) is formed in the inner part of the ground ring(6). The cavity(20) is also in a rectangular shape. The plurality of slot holes(10) are implemented on the inner wall of the cavity(20), and couples the ground ring(6) and the circuit pattern(3) formed under the BT resin(1).
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