| 摘要 |
Despite the extremely flat construction, it is intended significantly to reduce the tendency of the semiconductor chip (1), which is embedded in the plastic housing (10) of the electronics module (M), to fracture. The chip is mounted on the chip island (22) of a system support (20) in the form of a sheet-metal structure (lead frame). The external contacts (21) - which can be partially covered by the chip - lie in a plane on one flat side of the module housing (10). The slots (23) which bound the chip island (22) and represent unavoidable lines of weakness in the sheet metal of the system support run at inclined angles (preferably at 45@) to the edges of the square or rectangular chip (1) and thus also inclined with respect to possible lines of fracture which are produced in the chip material as a result of the monocrystalline structure and run parallel to the chip edges. Further slots (24), which originate from the slots (23), in the sheet metal likewise expediently run inclined with respect to the chip edges. Further measures relate to the mechanical connection between the parts of the system support (20) and the module housing (10), as well as to the connection of the entire module (M) to a surrounding plastic compound while being potted in a supporting body (for example chip-board production). <IMAGE> |
