摘要 |
PURPOSE: A stem carrier in a photo diode IC bonder is provided to accurately feed stems by one pitch without setting accurate positions, decrease the volume of overall system and reduce costs. CONSTITUTION: A plurality of stems(1) are loaded on a carrier(3), and holes for inserting pins are formed on both sides of the loading position. A carrier feeder feeds the carrier by one pitch of feeding unit of the stems(1) loaded on the carrier(3). A carrier positioner positions the carrier(3) fed by the carrier feeder. A stem provider lifts the stems(1) on the carrier(3) positioned by the carrier positioner to supply the stems to a working position. A stem reference position decider decides the reference position of the stem(1) provided from the stem provider. A stem position completer completes positions the stems(1) using two pins.
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