| 摘要 |
<p>A mechanical assembly for regulating the temperature of an integrated circuit chip (50) is comprised of a frame (10) which has at least two spaced-apart spring supports. Respective leaf springs (30b, 30d) extend from each of the spring supports towards each other. And, a heat exchanger (20) lies in the space between the spring supports, attaches to all of the leaf springs (30b, 30d), and has a face (21) for mating with the chip (50). With this assembly, the heat exchanger (20) exerts a very small force at its initial point of contact on the chip (50); the length of the leaf springs (30b, 30d) do not add to the profile of the assembly; no slippage occurs between the heat exchanger (20) and the chip (50); and, the leaf springs (30b, 30d) prevent the heat exchanger (20) from twisting and becoming offset relative to the chip (50).</p> |
