发明名称 COMPACT MOLDING APPARATUS AND METHOD
摘要 <p>A molding apparatus (20) including a support frame (21) and a molding method utilizing a moveable mold platen (22) and a second or door platen (26) both of which may hold, have affixed to, or carry a first or second portion of a mold. The door platen (26) is opened and shut by a hinge means (29), is movable using tie bars (70) and tie bar plates (71) and is operated by the use of a fluid cylinder (38) and control valves (88, 89, 90). The door platen (26) advances a mold base (24) adjacent a mold core (25), and is brought adjacent to the moveable mold platen (22), so that the portions of the mold engage one another. A molding material is injected into the mold cavity, after which the moveable platen (22) is retracted, the door platen (26) is opened, and the part is removed. A part to be encapsulated may be placed into the mold and held by vacuum heads (94) operated by control valves (90, 93) before the molds are closed.</p>
申请公布号 WO2000034021(A1) 申请公布日期 2000.06.15
申请号 US1999029237 申请日期 1999.12.09
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