发明名称 Layer sequence structuring on silicon wafers by plasma etching involves monitoring photolacquer degradation by activated hydrogen spectral line intensity determination
摘要 Photolacquer covered layer sequence production comprises photolacquer degradation monitoring during plasma etching by activated hydrogen spectral line intensity determination. In the production of a photolacquer covered layer sequence on a silicon substrate, involving spectrographic analysis of plasma-activated etching gases during plasma etching, degradation of the photolacquer is monitored by evaluating the intensity of a spectral line of activated hydrogen released into the plasma from the photolacquer. Preferred Features: The intensity of the spectral line of 656.278 nm wavelength, emitted by ionized hydrogen, is measured.
申请公布号 DE19860152(C1) 申请公布日期 2000.06.15
申请号 DE19981060152 申请日期 1998.12.24
申请人 TEMIC SEMICONDUCTOR GMBH;IPC FAB AUTOMATION GMBH 发明人 DIETZ, FRANZ
分类号 H01L21/66;(IPC1-7):H01L21/66;H01L21/306;B23K28/00 主分类号 H01L21/66
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