Very fine circuit production on polymer involves structurization by erosion with short wavelength electromagnetic radiation using metal coat penetrated by photons and erosion by plasma formed at interface with polymer

摘要

In making very fine circuits by structurized metallization, insulation channels are made by using (i) a metal base coat of maximum thickness corresponding to the photon penetration depth of short wavelength electromagnetic radiation and (ii) energy density such that the radiation penetrates the metal and a plasma caused by energy absorbed at the polymer substrate interface removes metal, giving sharp-edged channels and no residue. Structurized metallization of polymer substrates for making very fine circuits involves (a) completely covering the substrate with a base layer; (b) using short-wavelength electromagnetic radiation, preferably ultraviolet radiation, more especially from a laser, to remove the base layer completely in areas requiring insulating channels; and (c) electroless metallization of the remaining structurized base layer. The novel features are that (i) the base layer is a metal layer with a maximum thickness corresponding to the photon penetration depth of the radiation used; and (ii) the energy density is regulated so that the radiation penetrates the metal without causing erosion and the energy is absorbed at the interface with the polymer substrate, forming a plasma that removes the metal to form insulating channels with sharp edges and no residue.