发明名称 |
METHOD FOR FORMING CAPACITOR INCLUDING TANTALUM OXIDE |
摘要 |
PURPOSE: A method for forming capacitor including tantalum oxide is provided to thicken a tantalum oxide layer on a lower capacitor electrode for preventing a surface of the electrode from oxidation. CONSTITUTION: A method for forming capacitor including tantalum oxide includes first thru fifth steps. In the first step, a lower capacitor electrode(42) is formed electrically coupled to a conduction extension layer(41) on a board(40). In the second step, a plasma nitride layer(43) is formed on the lower capacitor electrode(42). In the third step, a tantalum oxide dielectric layer(44) is formed on the plasma nitride layer(43). In the forth step, an oxide annealing is performed on the tantalum oxide dielectric layer(44). In the fifth step, a upper capacitor layer is formed on the plasma nitride layer(43).
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申请公布号 |
KR20000033119(A) |
申请公布日期 |
2000.06.15 |
申请号 |
KR19980049803 |
申请日期 |
1998.11.19 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, SEONG TAE;KIM, GYOUNG HOON;JANG, WON JOON;KIM, DO HYOUNG |
分类号 |
H01L27/10;(IPC1-7):H01L27/10 |
主分类号 |
H01L27/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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