发明名称 METHOD FOR FORMING CAPACITOR INCLUDING TANTALUM OXIDE
摘要 PURPOSE: A method for forming capacitor including tantalum oxide is provided to thicken a tantalum oxide layer on a lower capacitor electrode for preventing a surface of the electrode from oxidation. CONSTITUTION: A method for forming capacitor including tantalum oxide includes first thru fifth steps. In the first step, a lower capacitor electrode(42) is formed electrically coupled to a conduction extension layer(41) on a board(40). In the second step, a plasma nitride layer(43) is formed on the lower capacitor electrode(42). In the third step, a tantalum oxide dielectric layer(44) is formed on the plasma nitride layer(43). In the forth step, an oxide annealing is performed on the tantalum oxide dielectric layer(44). In the fifth step, a upper capacitor layer is formed on the plasma nitride layer(43).
申请公布号 KR20000033119(A) 申请公布日期 2000.06.15
申请号 KR19980049803 申请日期 1998.11.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, SEONG TAE;KIM, GYOUNG HOON;JANG, WON JOON;KIM, DO HYOUNG
分类号 H01L27/10;(IPC1-7):H01L27/10 主分类号 H01L27/10
代理机构 代理人
主权项
地址