摘要 |
A method for protecting at least one wafer from contamination, the method including the steps of heating the wafer in an apparatus for semiconductor processing having a reaction core (102), providing a first voltage level to a wafer transfer device (108), and providing a second voltage level lower than the first voltage level, near the reaction core (102), thereby activating the protection. |
申请人 |
SIZARY LTD.;ZINMAN, YOSEF;RAVID, ARIE;RASKIN, YOSEF;SCHOICHET, LEV;SERGIENKO, ALEX;ROITMAN, ILYA |
发明人 |
ZINMAN, YOSEF;RAVID, ARIE;RASKIN, YOSEF;SCHOICHET, LEV;SERGIENKO, ALEX;ROITMAN, ILYA |