MECHANICAL ASSEMBLY FOR REGULATING THE TEMPERATURE OF AN ELECTRONIC DEVICE

摘要

A mechanical assembly for regulating the temperature of an integrated circuit chip is comprised of a frame (70) which has two spaced-apart spring supports (72). A single leaf spring (80) extends from one of the spring supports to the other. A heat exchanger (90) contacts the leaf spring at one point, pushes the leaf spring against the spring supports, and has a face (91) for mating with the chip. And, a pair of stop (100) is provided between the heat exchanger (90) and the frame (70), which keeps the heat exchanger on the leaf spring (80). With this assembly the heat exchanger (90) exerts a very small force at its initial point of contact on the chip; the length of the single leaf spring (80) does not add to the profile of the assembly; no slippage occurs between the heat exchanger (90) and the chip; and, the stop prevents the heat exchanger from twisting and becoming offset relative to the chip.