AN INTEGRATED CIRCUIT DEVICE

摘要

An integrated circuit device comprises an active circuit (4) provided in an active circuit area at a surface (5) of a semiconductor body (6), a plurality of bond pads (3) disposed substantially over the active circuit area and electrical connections between the bond pads (3) and the active circuit (4). Each one of the bond pads (3) has a wire-bonding region (23) for bonding a wire (24) and a circuit-connecting region (22) for the electrical connection with the active circuit (4). The active circuit (4) comprises active circuit devices (7), an interconnect structure comprising at least one patterned metal layer disposed in overlying relationship relative to the active circuit devices (7) and a layer (20) of passivating material disposed atop the interconnect structure, through which the electrical connections pass. The layer (20) of passivating material substantially consists of inorganic material and is substantially free from interruptions beneath the wire-bonding region (23) of the bond pads (3). The bond pads (3) and the layer (20) of passivating material have thicknesses that jointly counteract the occurrence of damage to the active circuit (4) during bonding of the wire (24) to the wire-bonding region (23).