发明名称 |
Mikromechanisches elektrostatisches Relais |
摘要 |
The inventive micromechanical electrostatic relay has at least one base substrate (1) with a flat base electrode, and an armature tongue (21) that has been relieved from an armature substrate (2), with a flat armature electrode. A wedge-shaped air gap (10) is formed between the base substrate (1) and the armature tongue. An electret layer (15, 25) is also configured on at least one of the substrate surfaces (11; 31), this electret layer being made up of a plurality of programmable, non-volatile storage locations (EEPROMs). A switching characteristic in the form of a make-contact, a break-contact or a changeover switch can be obtained in this manner.
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申请公布号 |
DE19854450(A1) |
申请公布日期 |
2000.06.15 |
申请号 |
DE19981054450 |
申请日期 |
1998.11.25 |
申请人 |
TYCO ELECTRONICS LOGISTICS AG, STEINACH |
发明人 |
HESSE, SUSANNA KIM;GEVATTER, HANS-JUERGEN;SCHLAAK, HELMUT;HANKE, MARTIN |
分类号 |
H01H59/00;(IPC1-7):H01H59/00 |
主分类号 |
H01H59/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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