PHOTO APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD THEREFOR

摘要

PURPOSE: A photo apparatus for manufacturing semiconductor devices and a method therefor are provided to acquire a cooling efficiency for wafers so that a mismatching between a photo mask and the wafers, without prolonging photo process time. CONSTITUTION: A photo apparatus for manufacturing semiconductor devices comprises a spinner(10) and an exposing apparatus(40). The spinner(10) includes a coating portion(11), a heating portion(13), a 1st cooling portion(15) and a developing portion(17). The coating portion(11) coats a photoresist layer on a wafer. The heating portion(13) heats a wafer to harden the photoresist layer. The 1st cooling portion(15) cools the heated wafer. The developing portion(17) develops the photoresist layer of the exposed wafer. The exposing apparatus(40) includes a pre-matching portion(21) and an exposing portion(23). The pre-matching portion(21) preliminary matches the cooled wafer. The exposing portion(23) exposes the photoresist layer of the pre-matched wafer. Here, a 2nd cooling portion(41) is installed between the pre-matching portion(21) and exposing portion(23) to cool the pre-matched wafer, so that a mismatching of the wafer due to a thermal damage is prevented at the exposing portion(23).