SUBSTRATE FOR SEMICONDUCTOR DEVICE PACKAGE, SEMICONDUCTOR DEVICE PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A substrate for semiconductor package, a semiconductor package, and a method for manufacturing the same are provided to form a multi-pin on a package by providing a substrate for semiconductor package without a lead frame. CONSTITUTION: A substrate for semiconductor package comprises an insulating substrate(11), the first land(12a), the second land, a hole(13), a conductive layer(13a), and a cavity(13b). The first land(12a) is formed on the insulating substrate(11). The second land is formed at a lower face of the insulating substrate(11). The hole(13) is formed at one end of the first land(12a) and the second land. The conductive layer(13a) is formed at an inner wall of the hole(13). The cavity(13b) is formed along a center line of the hole(13).