COMPOSITE MATERIAL AND USE THEREOF

摘要

A composite material having a high thermal conductivity, a low coefficient of thermal expansion, and a high plastic workability and the use thereof in the fields of semiconductors and so forth. Specifically, a composite material comprising a metal and particles of an inorganic compound having a coefficient of thermal expansion lower than that of the metal, characterized in that the particles are dispersed in the form of a lump having a complicated configuration wherein at least 95% of the particles are connected to one another. It is possible to obtain a composite material which contains 20 to 80 vol.% of copper oxide, the balance being copper, has a coefficient of thermal expansion of 5x10<-6> to 14x10<-6>/ DEG C in the temperature range of room temperature to 300 DEG C and a thermal conductivity of 30 to 325 W/m.K, and can be applied to heatsinks of semiconductor devices and dielectric plates of electrostatic adsorbers.