| 摘要 |
PURPOSE: A semiconductor chip test socket and a method for contactor fabrication are provided to fix a contactor to a land pattern provided to a PCB circuit board without using solder, minimize the length of the contactor, enhance the electric conductivity of the contactor by forming the contactor with plural layers, and bend the contactor for generating elasticity. CONSTITUTION: A plurality of conductive plates of predetermined length and width are laminated on a contactor(300). A curved part(213) of a predetermined slope is formed on an inner sidewall of a contactor insertion hole, and a bending space(211) is formed on another sidewall of the insertion hole for providing a space against the bending of the contactor(300). Therefore, when the contactor(300) is inserted into the insertion hole, the natural bending of the contactor(300) is generated by the curved part(213).
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