发明名称 |
Methods for manufacture of electronic devices |
摘要 |
<p>The present invention relates to new methods for manufacturing electronic packaging devices, particularly printed circuit boards. Methods of the invention include use of reduced pH sweller and etch treatments tat can produce printed circuit boards and other devices that are substantially more robust and reliable than produced by prior methods.</p> |
申请公布号 |
EP1009203(A2) |
申请公布日期 |
2000.06.14 |
申请号 |
EP19990124090 |
申请日期 |
1999.12.13 |
申请人 |
SHIPLEY COMPANY LLC |
发明人 |
ESPOSITO, CHRISTOPHER P.;TAKAHIRO, KOBAYASHI;KONDOH, MASAKI;BAYES, MARTIN W. |
分类号 |
H05K3/06;C09K13/04;C23F1/00;C23F1/18;C23F1/34;H05K3/00;H05K3/26;H05K3/42;(IPC1-7):H05K3/42 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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