Method for connecting two conductor structures and resin object

摘要

Conductive bumps (2) deposited on a first conductive structure (1) are surrounded by penetrations (4) made in a second conductor (3). Deformation of the bumps, fixes the structures together, in electrical contact. An Independent claim is included for a plastic object comprising a sheet and electronic module. The module has a first conductor structure. The side of the sheet against the interior of the plastic object, has a second conductive structure with penetrations (4). The second structure forms an antenna. Attachment and contact, is made using bumps as described. Preferred features: The electronic module is located in an opening of the sheet and has a third conductor structure, with a contact surface accessible for connection from the outside.