发明名称 SOLDERING MEMBER FOR PRINTED WIRING BOARDS
摘要 This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal. <IMAGE>
申请公布号 EP1009202(A1) 申请公布日期 2000.06.14
申请号 EP19980923088 申请日期 1998.06.02
申请人 IBIDEN CO., LTD. 发明人 TSUKADA, KIYOTAKA;KOBAYASHI, HIROYUKI;UKAI, YOSHIKAZU;CHIHARA, KENJI;TOHYAMA, YOSHIHIDE;OKUDA, YASUYOSHI;KODERA, YOSHIHIRO
分类号 B23K35/00;B23K35/26;H01L23/498;H05K3/24;H05K3/34 主分类号 B23K35/00
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