发明名称 |
SOLDERING MEMBER FOR PRINTED WIRING BOARDS |
摘要 |
This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal. <IMAGE> |
申请公布号 |
EP1009202(A1) |
申请公布日期 |
2000.06.14 |
申请号 |
EP19980923088 |
申请日期 |
1998.06.02 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
TSUKADA, KIYOTAKA;KOBAYASHI, HIROYUKI;UKAI, YOSHIKAZU;CHIHARA, KENJI;TOHYAMA, YOSHIHIDE;OKUDA, YASUYOSHI;KODERA, YOSHIHIRO |
分类号 |
B23K35/00;B23K35/26;H01L23/498;H05K3/24;H05K3/34 |
主分类号 |
B23K35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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