发明名称 Process for heat bonding of semi-crystalline polymers with metals
摘要 The invention relates to a process for the heat bonding of semicrystalline polymers to metals under pressure and at a temperature between the glass transition temperature and the softening point of the polymer, by prior irradiation of the polymer surface with UV radiation, produced by decomposition of excimers, in the wavelength range from 120 to 400 nm and having an energy density below the ablation threshold.
申请公布号 EP0589351(B1) 申请公布日期 2000.06.14
申请号 EP19930114894 申请日期 1993.09.16
申请人 HEITZ, JOHANNES, DR.;BAEUERLE, DIETER, PROF. DR.;HAGEMEYER, ALFRED, DR.;HIBST, HARTMUT, PROF. DR. 发明人 HEITZ, JOHANNES, DR.;BAEUERLE, DIETER, PROF. DR.;HAGEMEYER, ALFRED, DR.;HIBST, HARTMUT, PROF. DR.
分类号 B29C35/08;B29C59/16;B29C65/00;C08J5/12;C08J7/00 主分类号 B29C35/08
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