Process for heat bonding of semi-crystalline polymers with metals
摘要
The invention relates to a process for the heat bonding of semicrystalline polymers to metals under pressure and at a temperature between the glass transition temperature and the softening point of the polymer, by prior irradiation of the polymer surface with UV radiation, produced by decomposition of excimers, in the wavelength range from 120 to 400 nm and having an energy density below the ablation threshold.
申请公布号
EP0589351(B1)
申请公布日期
2000.06.14
申请号
EP19930114894
申请日期
1993.09.16
申请人
HEITZ, JOHANNES, DR.;BAEUERLE, DIETER, PROF. DR.;HAGEMEYER, ALFRED, DR.;HIBST, HARTMUT, PROF. DR.
发明人
HEITZ, JOHANNES, DR.;BAEUERLE, DIETER, PROF. DR.;HAGEMEYER, ALFRED, DR.;HIBST, HARTMUT, PROF. DR.