发明名称 HEAT SEALING MACHINE
摘要 PURPOSE: A heat sealing machine is provided to accurately perform a heat-pressing process for a PCB and an LCD by controlling the pressure, temperature and period for the heat-pressing process as well as to greatly shorten the working period to enhance the productivity. CONSTITUTION: A turntable(4) is mounted on a base plate(1) to be rotated in the heat compressing process for a PCB(2) and an LCD(3). A plurality of jigs(5) for preventing the floating of the PCB(2) and LCD(3) during the heat compressing process are mounted on a top outer surface of the turntable(4). A rotary actuator(6) is connected to the turntable to generate the power for rotating the turntable. A heat block(7) is mounted over the jigs(5) for thermally pressing the PCB and LCD by the lift motion. An air cylinder for lifting/dropping the heat block(7) is mounted under the base plate(1). A sensor for sensing the pressure, temperature and compressing period for the thermal pressing process against the PCB and LCD is mounted on a third connecting member.
申请公布号 KR100259161(B1) 申请公布日期 2000.06.15
申请号 KR19970040806 申请日期 1997.08.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 IN, MUN-KWAN
分类号 H05K13/04;(IPC1-7):H05K13/04 主分类号 H05K13/04
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